Gate dielectric of semiconductor device

ABSTRACT

A method of fabricating a semiconductor device having a different gate structure in each of a plurality of device regions is described. The method may include a replacement gate process. The method includes forming a hard mask layer on oxide layers formed on one or more regions of the substrate. A high-k gate dielectric layer is formed on each of the first, second and third device regions. The high-k gate dielectric layer may be formed directly on the hard mask layer in a first and second device regions and directly on an interfacial layer formed in a third device region. A semiconductor device including a plurality of devices (e.g., transistors) having different gate dielectrics formed on the same substrate is also described.

BACKGROUND

The present disclosure relates generally to forming an integratedcircuit device on a substrate and, more particularly, to forming a gateoxide layer of a semiconductor device.

Semiconductor device geometries continue to dramatically decrease insize. Today's fabrication processes are routinely producing deviceshaving feature dimensions less than 65 nm. However, solving the problemsassociated with implementing new process and equipment technology whilecontinuing to satisfy device requirements has become more challenging.For example, metal-oxide-semiconductor (MOS) transistors have typicallybeen formed with polysilicon gate electrodes. Polysilicon hasadvantageous thermal resistive properties and can allow for formation ofself aligned source/drain structures.

However, in order to continually meet performance requirements, has beena desire to replace the polysilicon gate electrode with a metal gateelectrode. One process of implementing metal gates is terms a “gatelast” or “replacement gate” methodology. In such a process, a dummy(e.g., sacrificial) polysilicon gate is initially formed, variousprocesses associated with the semiconductor device are performed, andthe dummy gate is subsequently removed and replaced with a metal gate.However, problems arise when integrating a gate last process with otherfabrication processes such as the formation of multiple gate oxideconfigurations on the same device (e.g., chip or die) such as insystem-on-a-chip (SOC) designs.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with the accompanying figures. It is emphasizedthat, in accordance with the standard practice in the industry, variousfeatures are not drawn to scale and are used for illustration purposesonly. In fact, the dimensions of the various features may be arbitrarilyincreased or reduced for clarity of discussion.

FIG. 1 is an embodiment of a method according to one or more aspects ofthe present disclosure.

FIGS. 2-10 are cross-sectional views of a semiconductor device atvarious stages of fabrication according to the method of FIG. 1.

FIG. 11 is a cross-sectional view of a semiconductor device having agate dielectric according to various aspects of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. In addition, the present disclosure mayrepeat reference numerals and/or letters in the various examples. Thisrepetition is for the purpose of simplicity and clarity and does not initself dictate a relationship between the various embodiments and/orconfigurations discussed.

Referring to FIG. 1, illustrated is a method 100 for fabricating asemiconductor device using a gate last methodology. FIGS. 2, 3, 4, 5, 6,7, 8 a, 8 b, 9 and 10 are cross-sectional views of a semiconductordevice 200 at various stages of fabrication according to an embodimentof the method of FIG. 1.

It is understood that parts of the semiconductor device 200 may befabricated by complementary metal-oxide-semiconductor (CMOS) technologyprocess flow, and thus some processes are only briefly described herein.Further, the semiconductor device 200 may include various other devicesand features, such as other types of transistors such as additionaltransistors, bipolar junction transistors, resistors, capacitors,diodes, fuses, etc., but is simplified for a better understanding of theinventive concepts of the present disclosure. The semiconductor device200 includes a plurality of semiconductor devices (e.g., transistors),which may be interconnected. In an embodiment, the semiconductor device200 is a system-on-a-chip (SOC) device.

The method 100 begins at block 102 where a semiconductor substrate isprovided. The semiconductor substrate includes a plurality of deviceregions. In an embodiment, the plurality of device regions may beassociated with regions of a SOC device. In each region, differentdevice types may be formed such as, for example, input/output (I/O)devices, high performance devices, low power devices, core devices,and/or other suitable device types. In an embodiment, a first region ofthe plurality of regions is an input/output region where one or more I/Odevices will be formed; the second region of the plurality of regions isa lower power device area where one or more low power devices will beformed; and the third region of the plurality of regions is a coredevice area where one or more additional semiconductor devices (e.g.,n-type or p-type field effect transistors (e.g., high performancedevices)) will be formed. In an embodiment, the devices of at least twoof the regions of the plurality of regions are designed to havedifferent gate stacks. For example, the devices of two different regionsmay be designed to have a different configuration of gate dielectricincluding a different composition, different thickness, different order,etc.

The semiconductor substrate may be silicon substrate. Other exemplarysubstrate materials include elementary semiconductors such as germaniumand diamond, compound semiconductor(s), and/or alloy semiconductor(s).The substrate may further include various doping configurationsdepending on design requirements. The substrate may include an epitaxiallayer, may be strained for performance enhancement, and/or may include asilicon-on-insulator (SOI) structure.

Referring to the example of FIG. 2, a semiconductor substrate 202 isprovided. The substrate 202 includes silicon. The substrate 202 includesa first region 204, a second region 206, and a third region 208. In anembodiment, the first region 204 is an I/O area. In an embodiment, thesecond region 206 is a lower power device area. In an embodiment, thethird region 208 is a core device area. The semiconductor substrate 202includes isolation structures 210 formed on the substrate 202 forisolating the regions of the substrate. The isolation structures 210 maybe formed of silicon oxide, silicon nitride, silicon oxynitride,fluoride-doped silicate glass (FSG), a low-k dielectric material, and/orother suitable insulating material. The isolation structures 210 may beshallow trench isolation (STI) features, local oxidation (e.g., LOCOS),and/or other suitable isolation structures.

The method 100 then proceeds to block 104 where a first gate dielectricis formed. The first gate dielectric may be a thermally grown oxide suchas silicon dioxide (also referred to as silicon oxide). The first gatedielectric may include between approximately 15 Angstroms andapproximately 60 Angstroms, by way of example and not intended to belimiting.

In an embodiment, the first gate dielectric is initially grown on thefirst, second and third regions of the semiconductor substrate. In anembodiment, after being thermally grown on all exposed areas of thesemiconductor substrate, the first gate dielectric may be removed fromthe second and third device region. In an embodiment, the first gatedielectric is removed from the second and third device areas usingsuitable photolithography and etching processes. An exemplary etchingprocess to remove the first gate dielectric includes a dilute HF wetetch. Thus, the first gate dielectric remains disposed on the firstregion of the substrate (e.g., the I/O area). In alternativeembodiments, the first dielectric is selectively grown only in the firstregion of the substrate.

In another embodiment, the first gate dielectric layer is a high-kdielectric material. The high-k dielectric layer may include hafniumoxide (HfO₂). Alternatively, the high-k dielectric layer may optionallyinclude other high-k dielectrics, such as TiO₂, HfZrO, Ta₂O₃, HfSiO₄,ZrO₂, ZrSiO₂, combinations thereof, or other suitable material. Thehigh-k dielectric layer may be formed by atomic layer deposition (ALD)and/or other suitable methods. The first gate dielectric layer of high-kdielectric material may be formed in the first device region usingsuitable deposition, photolithography and/or etching processes.

Referring to the example of FIG. 3, a first gate dielectric layer 302 isformed in the first device region 204. The first gate dielectric layer302 may be thermally grown silicon dioxide. In an embodiment, thethickness t1 of the first gate dielectric layer 302 is betweenapproximately 15 Angstroms and approximately 100 Angstroms. The firstgate dielectric layer 302 may form a portion of the gate dielectric of adevice to be formed in the first device region 204.

Having the first gate dielectric formed in the first region of thesubstrate, the method 100 then proceeds to block 106 where a seconddielectric layer is formed on the second device region. The seconddielectric layer may be an oxide layer (e.g., silicon dioxide). Thesecond dielectric layer may be formed by thermal oxidation, chemicalvapor deposition (CVD), atomic layer deposition (ALD), and/or othersuitable formation methods. In an embodiment, the second dielectriclayer is formed on the third device region, as well as the second deviceregion. The second dielectric layer may be thinner than the first gatedielectric layer, described above with reference to FIG. 3. The seconddielectric layer may be between approximately 10 Angstroms andapproximately 30 Angstroms, by way of example and not intended to belimiting. The second dielectric layer may serve as a gate dielectric (orportion thereof) for a device in the second device region. Alternative,the second dielectric layer may serve as an interfacial layer for thedevice in the second device region.

Referring to the example of FIG. 4, a second dielectric layer 402 isformed on the second device region 206 and the third device region 208.In an embodiment, the second dielectric layer 402 is omitted from thethird device region 208. The thickness t2 of the second dielectric layer402 may be between approximately 10 Angstroms and approximately 30Angstroms. The thickness t2 may be less than the thickness t1,illustrated in FIG. 3. The second dielectric layer 402 may be formed bythermal oxidation, chemical vapor deposition (CVD), atomic layerdeposition (ALD), and/or other suitable formation methods.

The method 100 then proceeds to block 108 where a hard mask layer isformed on the first device region and/or the second device region. Thehard mask layer may include a nitride. In an embodiment, the hard masklayer is SiN. Other exemplary materials include metal nitride such asTiN. The hard mask layer may be deposited on the substrate usingsuitable deposition techniques such as CVD or PVD. The hard mask layermay be concurrently formed on the third device region and subsequentlyremoved by suitable processes such as photolithography patterning toexpose the third device (e.g., while protecting the first and secondareas) and performing an etch to remove the hard mask layer from thethird region. An exemplary etch includes a H₃PO₄ wet etch.

Referring to the example of FIG. 5, illustrated is a hard mask layer 502formed on the first device area 204 and the second device area 206. Inan embodiment, the hard mask layer 502 is SiN. In an alternativeembodiment, the hard mask layer 502 is not formed on the second deviceregion 206. The thickness of the hard mask layer 502 may betweenapproximately 5 Angstroms and approximately 30 Angstroms.

The method 100 then proceeds to block 110 where a dummy gate structureis formed. In an embodiment, a dummy gate electrode material isdeposited, for example, by physical vapor deposition (PVD) or CVD.Exemplary materials for the dummy gate electrode include polysilicon andother types of silicon. Referring to the example of FIG. 6, illustratedis the semiconductor device 200 including a dummy gate material 602formed on the substrate 202. The dummy gate material 602 may be formedby PVD and CVD across the substrate 202. In an embodiment, the dummygate material 602 is polysilicon.

The dummy gate material may then be patterned and etched into one ormore dummy gate electrodes. Referring to the example of FIG. 7, aplurality of dummy gate electrodes 702 are formed (from the dummy gatematerial 602, described above with reference to FIG. 6) on the substrate202. The dummy gate electrodes 702 may be formed overlying thedielectric materials and/or hard mask layer formed above in blocks 104,106, 108.

In further processing in block 110, spacer elements are formed on eitherside of the gate stack including dummy gate electrode as is known in theart. Referring to the example of FIG. 7, sidewall spacers 704 are formedadjacent the dummy gate electrodes 702. The sidewall spacers 704 mayinclude silicon nitride, silicon oxide, silicon oxynitride, and/or othersuitable dielectric materials. In embodiments, the sidewall spacers 704include a plurality of layers, for example, liner layers.

In further processing, an inter-layer dielectric (ILD) layer is formedon semiconductor substrate interposing the dummy gate electrodes.Referring to the example of FIG. 7, an ILD layer 706 is formed on thesubstrate 202. The ILD layer 706 may be formed by chemical vapordeposition (CVD), high density plasma CVD (HDP-CVD), spin-on deposition,physical vapor deposition (PVD or sputtering), or other suitablemethods. The ILD layer 706 may include silicon oxide, siliconoxynitride, a low-k material, and/or other suitable dielectric. The ILDlayer 706 may be conformally deposited on the substrate 202 and a CMPprocess performed. The dummy gate electrode 702 may serve as aplanarization stop for the CMP process. In other words, the CMP processmay be stopped at the exposure of the top surface of the dummy gateelectrode.

As in typical fabrication, source/drain regions or portions thereof maybe formed adjacent the dummy gate electrode prior to the sidewallspacers and/or ILD layer being formed. Additional steps typical of agate last or replacement gate process may be performed.

The method 100 then proceeds to block 112 where the dummy gate electrodeis removed from the substrate. The dummy gate electrode may be removedby an etching solution such as, for example, NH₄OH, dilute-HF, and/orother suitable etchant. In an alternative embodiment, the dummy gateelectrode may be removed by a suitable dry etching process. Referring tothe example of FIGS. 8 a and 8 b, the dummy gate electrodes 702 havebeen removed from the substrate leaving trenches 802. It is noted thatwhen the dummy gate electrode 702 is removed, the underlying dielectriclayers (e.g., the first gate dielectric 302, the second dielectric 402)and the hard mask layer 502 remain on the substrate 202.

The method 100 then proceeds to block 114 where an interfacialdielectric layer is formed in the third device region. In an embodiment,the second dielectric layer formed in block 106 described above isremoved from the third device region prior to forming the interfacialdielectric layer in the third region. Alternatively, the dielectriclayer formed in block 114 may form a portion or all, of an interfaciallayer for a device in the third device region, as described in furtherdetail below. In other words, the second dielectric layer of bock 106may remain on the substrate in the third device region.

The interfacial dielectric layer may include silicon oxide layer (SiO₂)or silicon oxynitride (SiON). In an embodiment, the interfacialdielectric has a thickness ranging from about 5 to about 15 angstroms.The interfacial dielectric layer may be formed by chemical oxidation,thermal oxidation, ALD, CVD, and/or other suitable dielectric.

The interfacial dielectric layer may additionally and/or alternatively,form a gate dielectric layer or portion thereof for the device(s) of thethird region. In an embodiment, the interfacial dielectric layer formedin third device region (e.g., after removal of the second dielectriclayer) is a high-k dielectric. The high-k dielectric layer may includehafnium oxide (HfO₂). Alternatively, the high-k dielectric layer mayoptionally include other high-k dielectrics, such as TiO₂, HfZrO, Ta₂O₃,HfSiO₄, ZrO₂, ZrSiO₂, combinations thereof, and/or other suitablematerial. The high-k dielectric layer may be formed by atomic layerdeposition (ALD) and/or other suitable methods. In an embodiment, thehigh-k dielectric layer is between approximately 5 Angstroms andapproximately 15 Angstroms.

Referring to the example of FIG. 8 a, the second dielectric layer 402 isremoved from the third device region 208. A dielectric layer 804 isformed on the third region 208 of the substrate 202. The dielectriclayer 804 is formed at the bottom of the trench 802 in the third region208. In an embodiment, the dielectric layer 804 is a silicon oxidelayer. In a further embodiment, the dielectric layer 804 may be formedby thermal oxidation. As described above, in other embodiments thedielectric layer 804 may be an oxide or high-k dielectric.

In an embodiment of the method 100, the block 114 is omitted. In such anembodiment the second dielectric layer formed in block 106 may bemaintained on the third region. Referring to the example of FIG. 8 b,illustrated is second dielectric layer 402 disposed in the third deviceregion 208. The second dielectric layer 402 may be an interfacial layerfor a device formed in the third device region 208.

The method 100 then proceeds to block 116 where a high-k gate dielectriclayer is formed on the substrate. The high-k gate dielectric layer maybe formed on each of the first, second and third regions of thesubstrate concurrently. The high-k dielectric layer may include hafniumoxide (HfO₂). Alternatively, the high-k dielectric layer may optionallyinclude other high-k dielectrics, such as TiO₂, HfZrO, Ta₂O₃, HfSiO₄,ZrO₂, ZrSiO₂, combinations thereof, and/or other suitable material. Thehigh-k dielectric layer may be formed by atomic layer deposition (ALD)and/or other suitable methods. The high-k dielectric layer may bebetween approximately 10 Angstroms and approximately 40 Angstroms inthickness. Referring to the example of FIG. 9, a high-k gate dielectriclayer 902 is formed on the substrate 202.

The method 100 then proceeds to block 118 where a metal gate is formedon the substrate. Block 118 begins with a first metal gate layer beingformed on the substrate. The first metal gate layer may be a workfunction layer. The first metal gate layer may include TiN, TaN, ZrSi₂,MoSi₂, TaSi₂, NiSi₂, WN, and/or other suitable material. The first metalgate layer may be selected based on a p-type or n-type device,respectively. The first metal gate layer may be deposited by CVD, PVD,and/or other suitable process.

Referring again to the example of FIG. 9, a first metal gate layer isformed on the substrate—a work function layer 904. The work functionlayer 904 may be between approximately 10 Angstroms and approximately100 Angstroms in thickness.

The method 100 and block 118 may continue to form additional layer(s) ofthe metal gate electrode including, for example, filler layers. A fillermetal layer such as Al, W, or Cu may then be deposited over the workfunction metal layer filling in the remaining portion of the trenchesformed by the removal of the dummy gate electrode. The filler metallayer may be formed by CVD, PVD, plating, or other suitable process.

After formation of one or more layers of the metal gate electrode, themethod 100 in general, and block 118 in particular, may continue toperform a chemical mechanical polish (CMP) process to planarize thesubstrate and remove the metal-gate material(s) and/or high-k materialformed on the surface of the ILD layer. Further suitable CMOS processesmay be performed such as, for example, formation contacts and amultiple-layer interconnect (MLI) structure. Furthermore, additionallayers may be formed in or on the metal gate electrode such as, forexample, capping layers.

Referring to the example of FIG. 10, the semiconductor device 200includes a filler material 1002 for the metal gate electrode. The CMPprocess, described above has planarized the device such that the surfaceof the ILD layer 706 surface is exposed. As illustrated in FIG. 10, anexemplary embodiment of the method 100 forms a semiconductor device(e.g., SOC) 100 that includes a plurality of gate structures includingdifferent configurations of gate structures. In particular, the gatestructures include different configurations of interfacial layers and/orgate dielectric layers. For example, the devices in regions 204, 206,and 208 include different thicknesses of dielectric layers, differentcompositions of dielectric layers, different quantities of dielectriclayers, etc.

The method 100 may then proceed to formation of other features of thedevice not discussed in detail herein, such as, for example,back-end-of-the-line (BEOL) processing and features (multi-layerinterconnects), contacts, and/or other suitable features as known in theart.

Referring to FIG. 11, illustrated is a semiconductor device 1100 havinggate dielectric layer(s) formed according to aspects of the presentdisclosure. The semiconductor device 1100 may be similar to thesemiconductor device 200 of FIGS. 2-10. It is noted that, for ease ofreference, element numbers are repeated from the above described ofFIGS. 2-10, these elements may be substantially similar as discussedabove. The device 1100 may be formed using the method 100, describedabove with reference to FIG. 1. However, the fabrication ofsemiconductor device 1100 is not limited thereto. FIG. 11 illustratesthree device types formed on a single semiconductor substrate. For easeof reference, these are referred to as a device 1102 including a gatestructure 1104, which is formed in a first region 204 of the substrate202; a device 1106 including a gate structure 1108, which is formed in asecond region 206 of the substrate 202; and a device 1110 including agate structure 1112, which is formed in a third region 208 of thesubstrate 202. As illustrated in FIG. 11, each of the device typesincludes a different gate stack-up. More specifically, each of thedevice types includes a gate dielectric that differs in composition,thickness, quantity or configuration (e.g., stack-up).

In an embodiment, the first device 1102 is an I/O device. In anembodiment, the second device 1106 is a low-power device. In anembodiment, the third device 1110 is a core device. The devices 1102,1106, and/or 1108 may be electrically coupled to form an SOC device1100.

The first gate structure 1104 includes a dielectric layer 302, a hardmask layer 502, and a high-k dielectric layer 902. In an embodiment, thedielectric layer 302 is silicon dioxide. In an embodiment, the hard masklayer is SiN. The dielectric layer 302 may be thicker than thedielectric layer 1114 and/or 402.

The second gate structure 1106 may include a dielectric layer 402, ahard mask layer 502, and a high-k dielectric layer 902. In analternative embodiment, the hard mask layer 502 may be omitted from thesecond gate structure 1106. In an embodiment, the hard mask layer 502 issilicon nitride. In an embodiment, the dielectric layer 402 is siliconoxide. The dielectric layer 402 may be thermally grown silicon oxide. Inan embodiment, the dielectric layer 402 provides the gate dielectric, orportion thereof, for the gate structure 1108. In an embodiment, thedielectric layer 402 provides an interfacial layer of the gate structure1110.

The third gate structure 1110 includes an interfacial layer 1114 and ahigh-k dielectric layer 902. The interfacial layer 1114 may besubstantially similar to the second dielectric 402, described above withreference to FIGS. 4 and 8 b, or be substantially similar to thedielectric layer 804 described above with reference to FIG. 8 a. In anembodiment, the interfacial layer 1114 is substantially similar to thedielectric layer 402 of the gate structure 1108. In an embodiment, theinterfacial layer 1114 is silicon oxide. In an alternative embodiment,the interfacial layer 1114 is a high-k dielectric layer, which may be adifferent composition than the high-k dielectric layer 902.

Each of the first, second and third gate structures 1104, 1108, and 1110respectively, further include a metal gate electrode having a workfunction layer 904, substantially similar to as discussed above, and asecond metal layer (e.g., filler) 1002. The devices 1102, 1110 and 1106further include source and drain regions formed adjacent to the gatestructures 1104, 1112 and 1108 respectively.

The present invention achieves different advantages in variousembodiments disclosed herein. For example, embodiments of the disclosedmethod and device provide a simple and cost-effective manner forintegrating gate structures with different gate dielectric materials andstack-ups in a gate last process.

Thus, provided is a method for fabricating a semiconductor device (e.g.,SOC device). The method includes providing a semiconductor substratehaving a first, second and third device region. A first dielectric layeris formed in the first region. In an embodiment, the first dielectric issilicon dioxide. Thereafter, a second dielectric layer is formed in thesecond region. In an embodiment, the second dielectric layer may be athinner layer of silicon dioxide. A hard mask layer is formed on thefirst device region on the first dielectric layer. In an embodiment, thehard mask layer is also formed on the second device region on the seconddielectric layer. A high-k dielectric layer on the first, second andthird device regions of the semiconductor substrate. The high-kdielectric layer is formed on the hard mask layer and the seconddielectric layer.

In another embodiment described, a method of fabricating a semiconductordevice is provided. The method includes forming a first oxide layer on afirst device region of a semiconductor substrate and separately, forminga second oxide layer on a second device region of the semiconductorsubstrate. The second oxide layer differs in thickness from the firstoxide layer. A hard mask layer is formed on the first oxide layer andthe second oxide layer. A dummy gate electrode is formed directly on thehard mask layer in each of the first and second device regions. A sourceor drain is formed adjacent the dummy gate electrode in the first deviceregion and a source or drain is formed adjacent the dummy gate electrodein the second device region. Thereafter, each of the dummy gateelectrodes is removed. However, the first oxide layer and the secondoxide layer remain disposed on the semiconductor substrate during theremoval. An interfacial layer is also formed in a third device region ofthe semiconductor substrate. In an embodiment, after the dummy gateelectrode is removed, an interfacial layer is formed in the third deviceregion. In an alternative embodiment, the interfacial layer is formed atthe time of the second dielectric layer (and includes the seconddielectric layer). The method continues to include forming a high-k gatedielectric layer on each of the first, second and third device regions.The high-k gate dielectric layer is formed directly on the hard masklayer in the first and second device regions and directly on theinterfacial layer in the third device region. A metal gate electrode isthen formed on the high-k gate dielectric layer.

Further, a semiconductor device is provided. The device includes asemiconductor substrate having a first gate structure formed in a firstregion, a second gate structure formed in a second region, and a thirdgate structure formed in a third region of the substrate. Each of thefirst, second and third gate structures include a different stack-up(e.g., composition and/or configuration of layer). The first gatestructure includes an oxide layer, a nitride layer on the oxide layer,and a high-k dielectric layer on the nitride layer. The second gatestructure includes an oxide layer, a nitride layer on the oxide layer,and a high-k dielectric layer disposed on the nitride layer. The thirdgate structure includes an interfacial layer and a high-k dielectriclayer disposed on the interfacial layer. In an embodiment, a metal gateelectrode is formed on the high-k dielectric layer.

The foregoing has outlined features of several embodiments so that thoseskilled in the art may better understand the detailed description thatfollows. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method for fabricating a semiconductor device,the method comprising: providing a semiconductor substrate having afirst, second and third device region; forming a first dielectric layerin the first region; thereafter, forming a second dielectric layer onthe second device region; forming a hard mask layer on the first deviceregion on the first dielectric layer; forming the hard mask layer on thesecond device region concurrently with the forming the hard mask layeron the first device region, wherein the hard mask layer is formed on thesecond dielectric layer; forming a dummy gate structure on the seconddielectric layer; and subsequently, removing the dummy gate structure toform a trench overlying the second dielectric layer, and forming ahigh-k dielectric layer on the first, second and third device regions,wherein the high-k dielectric layer is formed on the hard mask layer onthe first device region, and in the trench and on the hard mask layer onthe second dielectric layer.
 2. The method of claim 1, furthercomprising: forming the second dielectric layer in the third deviceregion while forming the second dielectric layer in the second deviceregion.
 3. The method of claim 2, further comprising: subsequently,removing the second dielectric layer in the third device region; andforming a third dielectric layer in the third device region, wherein thehigh-k dielectric layer is formed on the third dielectric layer.
 4. Themethod of claim 2, wherein the high-k dielectric layer is formed on thesecond dielectric layer in the third device region.
 5. The method ofclaim 1, wherein the first dielectric layer has a greater thickness thanthe second dielectric layer.
 6. The method of claim 1, wherein the hardmask layer is silicon nitride.
 7. The method of claim 1, wherein thehigh-k dielectric layer formed in the first region provides a gatedielectric for an input/output (I/O) device.
 8. A method of fabricatinga semiconductor device, the method comprising: forming a first oxidelayer on a first device region of a semiconductor substrate; forming asecond oxide layer on a second device region of the semiconductorsubstrate, wherein the second oxide layer differs in thickness from thefirst oxide layer; forming a hard mask layer on the first oxide layerand the second oxide layer; forming a dummy gate electrode on the hardmask layer in each of the first and second device regions; forming asource or drain adjacent the dummy gate electrode in the first deviceregion and a source or drain adjacent the dummy gate electrode in thesecond device region; thereafter, removing each of the dummy gateelectrodes, wherein the first oxide layer and the second oxide layerremain disposed on the semiconductor substrate during the removal;forming an interfacial layer in a third device region of thesemiconductor substrate; after removing the dummy gate electrodes,forming a high-k gate dielectric layer on each of the first, second andthird device regions, wherein the high-k gate dielectric layer is formeddirectly on the hard mask layer in the first and second device regionsand directly on the interfacial layer in the third device region; andforming a metal gate electrode on the high-k gate dielectric layer. 9.The method of claim 8, wherein the forming the first oxide layerincludes growing the first oxide layer on the first and the secondregions of the semiconductor substrate, and subsequently removing thefirst oxide layer from the second region.
 10. The method of claim 8,wherein the first oxide layer is silicon dioxide.
 11. The method ofclaim 8, wherein the forming the interfacial layer includes removing thesecond dielectric layer.
 12. The method of claim 8, wherein the formingthe interfacial layer is performed concurrently with the forming thesecond oxide layer in the second device region, the second oxide layerproviding the interfacial layer.
 13. The method of claim 8, wherein theforming the hard mask layer includes forming the hard mask layer on thethird device region concurrently with the first and second deviceregion, and subsequently removing the hard mask layer from the thirddevice region.
 14. The method of claim 8, wherein the forming the hardmask layer includes performing at least one of chemical vapor deposition(CVD) and atomic layer deposition (ALD).
 15. The method of claim 8,wherein the forming the hard mask layer includes depositing a nitridebased material.
 16. A method for fabricating a semiconductor device, themethod comprising: providing a semiconductor substrate having a first,second and third device region; forming a first dielectric layer in thefirst region; thereafter, forming a second dielectric layer in thesecond region; forming a hard mask layer on the first device region overthe first dielectric layer and in the second device region over thesecond dielectric layer; and forming a high-k dielectric layer on thefirst, second and third device regions, wherein the high-k dielectriclayer is formed over the hard mask layer.
 17. The method of claim 16,further comprising: forming a third dielectric layer in the third deviceregion, wherein the high-k dielectric layer is formed over the thirddielectric layer.
 18. The method of claim 17, further comprising:forming the second dielectric layer in the third device region whileforming the second dielectric layer in the second device region;subsequently, removing the second dielectric layer in the third deviceregion prior to forming the third dielectric layer.
 19. The method ofclaim 16, wherein the forming the high-k dielectric layer over the hardmask layer includes forming the high-k dielectric layer directly on thehard mask layer.